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Shenzhen Fuchao Technology

Product Details
  • image of Inline Module Sockets>0787301857
  • image of Inline Module Sockets>0787301857
Model 0787301857
Product Category Inline Module Sockets
Manufacturer Molex
Description 0.85MM DDR4 DIM
Encapsulation -
Package Bulk
RoHS Status 1
Obtain quotation information
image of Inline Module Sockets>15735567
15735567
Model
15735567
Product Category
Inline Module Sockets
Manufacturer
Molex
Description
0.85MM DDR4 DIM
Encapsulation
-
Package
Bulk
lang_roHSStatusStatus
1
Product parameters
TYPEDESCRIPTION
MfrMolex
Series78730
PackageBulk
Product StatusACTIVE
FeaturesLatches
Contact FinishGold
ColorBlue
Mounting TypeSurface Mount
Memory TypeDDR4 SDRAM
Height0.571" (14.50mm)
Card Thickness0.055" (1.40mm)
StandardsMO-309
Connector StyleDIMM
Contact Finish Thickness15.0µin (0.38µm)
Mounting FeatureNormal, Standard - Top
Number of Positions288
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