Language:en
  • zh-cn
  • en

Shenzhen Fuchao Technology

Product Details
  • image of Inline Module Sockets>0787302857
  • image of Inline Module Sockets>0787302857
Model 0787302857
Product Category Inline Module Sockets
Manufacturer Molex
Description 0.85MM DDR4 DIM
Encapsulation -
Package Bulk
RoHS Status 1
Obtain quotation information
image of Inline Module Sockets>15733933
15733933
Model
15733933
Product Category
Inline Module Sockets
Manufacturer
Molex
Description
0.85MM DDR4 DIM
Encapsulation
-
Package
Bulk
lang_roHSStatusStatus
1
Product parameters
TYPEDESCRIPTION
MfrMolex
Series78730
PackageBulk
Product StatusACTIVE
FeaturesLatches
Contact FinishGold
ColorBlue
Mounting TypeSurface Mount
Memory TypeDDR4 SDRAM
Height0.571" (14.50mm)
Card Thickness0.055" (1.40mm)
StandardsMO-309
Connector StyleDIMM
Contact Finish Thickness15.0µin (0.38µm)
Mounting FeatureNormal, Standard - Top
Number of Positions288
captcha

Service hours:9:00-18:00from Monday to Saturday
Please select online customer service:
+86-13723477211

Service hours:9:00-18:00from Monday to Saturday
Please select online customer service:
点击这里给我发消息
0