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Shenzhen Fuchao Technology

Product Details
  • image of Inline Module Sockets>10153311-004TLF
  • image of Inline Module Sockets>10153311-004TLF
Model 10153311-004TLF
Product Category Inline Module Sockets
Manufacturer Storage & Server IO (Amphenol Communications Solutions)
Description DDR4 SO DIMM
Encapsulation -
Package Tray
RoHS Status
Obtain quotation information
Price: $6.3000
Enter Quantity

Quantity

Price

Total Price

1728

$6.3000

$10,886.4000

image of Inline Module Sockets>11595376
11595376
Model
11595376
Product Category
Inline Module Sockets
Manufacturer
Storage & Server IO (Amphenol Communications Solutions)
Description
DDR4 SO DIMM
Encapsulation
-
Package
Tray
lang_roHSStatusStatus
Product parameters
TYPEDESCRIPTION
MfrStorage & Server IO (Amphenol Communications Solutions)
Series-
PackageTray
Product StatusACTIVE
FeaturesBoard Guide, Latches, Solder Retention
Contact FinishGold
ColorBlack
Mounting TypeThrough Hole
Memory TypeDDR4 SDRAM
Height0.571" (14.50mm)
Card Thickness0.047" (1.20mm)
Connector StyleSODIMM
Contact Finish Thickness15.0µin (0.38µm)
Mounting FeatureNormal, Standard - Top
Number of Positions260
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