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Shenzhen Fuchao Technology

Product Details
  • image of Inline Module Sockets>2128254005
  • image of Inline Module Sockets>2128254005
Model 2128254005
Product Category Inline Module Sockets
Manufacturer Molex
Description 0.85MM DDR4 DIM
Encapsulation -
Package Bulk
RoHS Status
Obtain quotation information
image of Inline Module Sockets>21738629
21738629
Model
21738629
Product Category
Inline Module Sockets
Manufacturer
Molex
Description
0.85MM DDR4 DIM
Encapsulation
-
Package
Bulk
lang_roHSStatusStatus
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrMolex
Series212825
PackageBulk
Product StatusACTIVE
FeaturesBoard Lock, Latches
Contact FinishGold
Mounting TypeSurface Mount
Memory TypeDDR4 SDRAM
StandardsMO-309
Connector StyleDIMM
Contact Finish Thickness30.0µin (0.76µm)
Mounting FeatureNormal, Standard - Top
Number of Positions288
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