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Shenzhen Fuchao Technology

Product Details
  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0741-05-B2C-1-A
  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0741-05-B2C-1-A
Model TE0741-05-B2C-1-A
Product Category Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Trenz Electronic
Description MODULE FPGA KIN
Encapsulation -
Package Bulk
RoHS Status
Obtain quotation information
image of Microcontrollers, Microprocessor, FPGA Modules>21724386
21724386
Model
21724386
Product Category
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Trenz Electronic
Description
MODULE FPGA KIN
Encapsulation
-
Package
Bulk
lang_roHSStatusStatus
Product parameters
TYPEDESCRIPTION
MfrTrenz Electronic
SeriesKintex™-7
PackageBulk
Product StatusACTIVE
Connector TypeBoard-to-Board (BTB) Socket
Size / Dimension1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature0°C ~ 70°C
Module/Board TypeFPGA
Core ProcessorXilinx Kintex-7 FPGA XC7K160T-2FBG676C
Flash Size32MB
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