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Shenzhen Fuchao Technology

Product Details
  • image of Memory>W66AP6NBQAHJ
  • image of Memory>W66AP6NBQAHJ
Model W66AP6NBQAHJ
Product Category Memory
Manufacturer Winbond Electronics Corporation
Description 1GB LPDDR4, X16
Encapsulation -
Package Tray
RoHS Status
Obtain quotation information
Price: $6.2100
Enter Quantity

Quantity

Price

Total Price

1

$6.2100

$6.2100

10

$5.5800

$55.8000

25

$5.2700

$131.7500

80

$4.5700

$365.6000

230

$4.3300

$995.9000

440

$3.8900

$1,711.6000

945

$3.2800

$3,099.6000

2400

$3.1200

$7,488.0000

image of Memory>22146274
22146274
Model
22146274
Product Category
Memory
Manufacturer
Winbond Electronics Corporation
Description
1GB LPDDR4, X16
Encapsulation
-
Package
Tray
lang_roHSStatusStatus
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrWinbond Electronics Corporation
Series-
PackageTray
Product StatusACTIVE
Package / Case200-TFBGA
Mounting TypeSurface Mount
Memory Size1Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
TechnologySDRAM - Mobile LPDDR4
Clock Frequency2.133 GHz
Memory FormatDRAM
Supplier Device Package200-TFBGA (10x14.5)
Write Cycle Time - Word, Page18ns
Memory InterfaceLVSTL_11
Access Time3.6 ns
Memory Organization64M x 16
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