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Shenzhen Fuchao Technology

Product Details
  • image of Memory>W66AQ6NBHAFJ
  • image of Memory>W66AQ6NBHAFJ
Model W66AQ6NBHAFJ
Product Category Memory
Manufacturer Winbond Electronics Corporation
Description 1GB LPDDR4X, X1
Encapsulation -
Package Tray
RoHS Status
Obtain quotation information
Price: $5.6200
Enter Quantity

Quantity

Price

Total Price

1

$5.6200

$5.6200

10

$5.0500

$50.5000

25

$4.7700

$119.2500

80

$4.1400

$331.2000

230

$3.9200

$901.6000

440

$3.5200

$1,548.8000

945

$2.9700

$2,806.6500

2400

$2.8200

$6,768.0000

image of Memory>22146350
22146350
Model
22146350
Product Category
Memory
Manufacturer
Winbond Electronics Corporation
Description
1GB LPDDR4X, X1
Encapsulation
-
Package
Tray
lang_roHSStatusStatus
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrWinbond Electronics Corporation
Series-
PackageTray
Product StatusACTIVE
Package / Case100-VFBGA
Mounting TypeSurface Mount
Memory Size1Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
TechnologySDRAM - Mobile LPDDR4X
Clock Frequency1.6 GHz
Memory FormatDRAM
Supplier Device Package100-VFBGA (10x7.5)
Write Cycle Time - Word, Page18ns
Memory InterfaceLVSTL_06
Access Time3.6 ns
Memory Organization64M x 16
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