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Shenzhen Fuchao Technology

Product Details
  • image of Memory>W66BP2NQUAHJ
  • image of Memory>W66BP2NQUAHJ
Model W66BP2NQUAHJ
Product Category Memory
Manufacturer Winbond Electronics Corporation
Description 2GB LPDDR4, DDP
Encapsulation -
Package Tray
RoHS Status
Obtain quotation information
Price: $7.2100
Enter Quantity

Quantity

Price

Total Price

1

$7.2100

$7.2100

10

$6.5100

$65.1000

25

$6.2100

$155.2500

80

$5.3900

$431.2000

230

$5.1500

$1,184.5000

440

$4.7000

$2,068.0000

945

$4.0900

$3,865.0500

2400

$3.9400

$9,456.0000

image of Memory>22146342
22146342
Model
22146342
Product Category
Memory
Manufacturer
Winbond Electronics Corporation
Description
2GB LPDDR4, DDP
Encapsulation
-
Package
Tray
lang_roHSStatusStatus
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrWinbond Electronics Corporation
Series-
PackageTray
Product StatusACTIVE
Package / Case200-TFBGA
Mounting TypeSurface Mount
Memory Size2Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
TechnologySDRAM - Mobile LPDDR4
Clock Frequency2.133 GHz
Memory FormatDRAM
Supplier Device Package200-TFBGA (10x14.5)
Write Cycle Time - Word, Page18ns
Memory InterfaceLVSTL_11
Access Time3.6 ns
Memory Organization64M x 32
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