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Shenzhen Fuchao Technology

Product Details
  • image of Memory>W66BP6NBHAFJ
  • image of Memory>W66BP6NBHAFJ
Model W66BP6NBHAFJ
Product Category Memory
Manufacturer Winbond Electronics Corporation
Description 2GB LPDDR4, X16
Encapsulation -
Package Tray
RoHS Status
Obtain quotation information
Price: $6.0600
Enter Quantity

Quantity

Price

Total Price

1

$6.0600

$6.0600

10

$5.4700

$54.7000

25

$5.2200

$130.5000

80

$4.5300

$362.4000

230

$4.3300

$995.9000

440

$3.9500

$1,738.0000

945

$3.4400

$3,250.8000

2400

$3.3100

$7,944.0000

image of Memory>22146254
22146254
Model
22146254
Product Category
Memory
Manufacturer
Winbond Electronics Corporation
Description
2GB LPDDR4, X16
Encapsulation
-
Package
Tray
lang_roHSStatusStatus
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrWinbond Electronics Corporation
Series-
PackageTray
Product StatusACTIVE
Package / Case100-VFBGA
Mounting TypeSurface Mount
Memory Size2Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
TechnologySDRAM - Mobile LPDDR4
Clock Frequency1.6 GHz
Memory FormatDRAM
Supplier Device Package100-VFBGA (10x7.5)
Write Cycle Time - Word, Page18ns
Memory InterfaceLVSTL_11
Access Time3.6 ns
Memory Organization128M x 16
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